Please do not form the LED after soldering .If forming id necessary ,it must be done before soldering .
Any unsuitable stress applied to the epoxy may break bonding wires in LED.
·SOLDERING:

Soldering Bath ---260℃±5 ℃ within 5 seconds: Soldering Iron-Under 30W within 5 seconds.(1.6mm from epoxy body)
Do not apply any force of mechanical stress onto the leads or epoxy body during soldering heat is remained.
If soldering one line of LED on a P.C . board by using a soldering iron ,don t solder both the leads of the LED at same time .
·CLEANING:

Use Alcohol ,Freon TE or Chlorosen to clean LED at normal temperature for less than l minute .
Do not use unspecified chemical liquid because it may cause crack or haze on the epoxy body.
·PREVENTING OVER CURRENT :

In order to operate LED in stable condition , please put protective resistors in series.
Resistor value can be determined by the formula
R= WHERE:
Vs=Source Voltage
VF=Forward Voltage
If=Recommended Current of LED (10-20mA)
·BRIGHTNESS:

For the purpose of obtaining uniform brightness, LED shall be same current.
It is useful for uniform brightness if you use larger source voltage and protective resistor .
QUALITY CONTROL AND ASSURANCE

·SAMPLING PLAN

U.S. Ministry of defense MIL-STD-105D level II(single sampling plans)

·INSPECTION ITEMS AND CRITERIONS FOR JUDGEMENTS

Measuring Methods for light Emitting Diodes (No.11830) and Light Emitting Diodes (No.11829) Stipulated by ministry of economical affairs of R.O.C.and by reference to Q.C. standards prevailing in prominent LED plants worldwide .

·RELIABILITY S

General provisions for Environmental s of CNS-Categorized electronic Parts ,3623-3634,5637,11233~11238,and U.S. ministry of National Defense MIL-STD-750 Specifications .